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AD7740
REV. A
3
 (VDD = 3.0 V to 3.6 V, 4.75 V to 5.25 V, GND = O V, REFIN = 2.5V)
Limit at T
MIN
, T
MAX
Limit at T
MIN
, T
MAX
Parameter  VDD = 3.0 V to 3.6 V   VDD = 4.75 V to 5.25 V   Unit
Conditions/Comments
f
CLKIN
32
32
kHz min    Clock Frequency
1
1
MHz max
t
HIGH
:t
LOW
40:60
40:60
min
Clock Mark/Space Ratio
60:40
60:40
max
t
1
50
35
ns typ
CLKIN Edge to FOUT Edge Delay
t
2
2.3
1.8
ns typ
FOUT Rise Time
t
3
1.6
1.4
ns typ
FOUT Fall Time
t
4
t
HIGH
 ?/SPAN>20
t
HIGH
 ?/SPAN>8
ns typ
FOUT Pulsewidth
NOTES
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specied with tr = tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of (V
IL
 + V
IH
)/2.
3
See Figure 1.
Specications subject to change without notice.
 t
3
 t
2
 t
1
 t
4
 t
HIGH
 t
LOW
CLKIN
FOUT
Figure 1. Timing Diagram
TIMING CHARACTERISTICS
1, 2, 3
ABSOLUTE MAXIMUM RATINGS*
(T
A
 = 25癈 unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . 0.3V to +7 V
Analog Input Voltage to GND . . . . . . . . 0.3V to V
DD
 + 0.3 V
Reference Input Voltage to GND . . . . . 0.3 V to V
DD
 + 0.3 V
Logic Input Voltage to GND . . . . . . . . 0.3 V to VDD + 0.3 V
FOUT Voltage to GND . . . . . . . . . . . 0.3 V to VDD + 0.3 V
Operating Temperature Range
Commercial (K Version) . . . . . . . . . . . . . . . . 0癈 to +85癈
Automotive (Y Version) . . . . . . . . . . . . . . 40癈 to +105癈
Storage Temperature Range . . . . . . . . . . . . 65癈 to +150癈
Junction Temperature (T
J
 Max) . . . . . . . . . . . . . . . . . . 150癈
SOT-23 Package
Power Dissipation . . . . . . . . . . . . . . . . . . (T
J
 Max  T
A
)/?/DIV>
JA
?/DIV>
JA
 Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 240癈/W
Lead Temperature (10 secs) . . . . . . . . . . . . . . . . . . 300癈
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . 220 + 5/0癈
Time at Peak Temperature . . . . . . . . . . . . 10 sec to 40 sec
microSOIC Package
Power Dissipation . . . . . . . . . . . . . . . . . (T
J
 Max  T
A
)/?/DIV>
JA
?/DIV>
JA
 Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206癈/W
?/DIV>
JC
 Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44癈/W
Lead Temperature (10 secs) . . . . . . . . . . . . . . . . . . . 300癈
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . 220 +5/0癈
Time at Peak Temperature . . . . . . . . . . . . . 10 sec to 40 sec
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specication is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7740 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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